micromat (KP) - Reliability of Material Interconnects in Electronics
The aim of the project is the development and application of innovative accelerated mechanical reliability assessment methods, tailored for qualification of a large variety of interconnects, as an alternative to time consuming conventional thermal test procedures supported by material science concepts. The knowledge gained within this project will be implemented during the design and manufacturing process to assess improved interconnect quality and long time reliability and to gain technological and scientific leadership in automotive and energy sectors.
Research topics:
- Detailed characterization of the complex interconnect microstructure as function of variation of production parameters and material combinations.
- Application and optimisation of fast innovative mechanical test techniques replacing standardized thermal testing for lifetime determination of interconnects.
- Development of non destructive evaluation methods based on vibrational and modal analysis using shaker systems.
- New life time and reliability models of interconnects based on analytical and simulation methods.
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